The aim of this project is to develop an Automated PCB
board etching system. One way of removing the unwanted copper is use a Computer
controlled milling machine which is the process fairly quick. However, chemical process method still widely using in
order to produces PCB and has facing problems where slower etching can cause
undercutting where copper is removed from under edge of the resist areas as
well narrowing the copper tracks and pads. In addition, weakening their
attachment on the substrate and cause problems that cannot produces fine and
closely tracks. Since all these, the Auto PCB etching machine combine with PIC,
bubble etching and mechanism methodology is produced. The platform designed
consists of a base with treaded travel mechanism applied on Y axis. Dc motor
applied on the axis to transfer the PCB through the system with special PCB
holder. The bubbles etching system have a feature such as controlled
temperature and draining system. The sequence of the process and temperature is
controlled by PIC which adopted Mikro C compiler as programming medium. In
addition, Users are able to select particular section of the process by keypad.
Each section of the etching process and temperature will display on LCD
display. For the purpose of display, the prototype system is demo under few
seconds for each process. A study had been found that a proper etching process
start with photo resist etching process with take five minutes. After that, go
to water washing process with two minutes and finally etching process take 15
minutes.
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